GB/T 20254.1-2015
ActiveCopper and copper alloy strips for lead frame—Part 1: Plane strip
引线框架用铜及铜合金带材 第1部分：平带
Application Summary AI generated
This standard specifies the technical requirements, dimensions, and testing methods for plane copper and copper alloy strips used in the manufacture of lead frames for semiconductor devices. It is applied in the electronics industry for producing integrated circuit and transistor lead frames, ensuring precise dimensional tolerances and material properties for reliable electrical connections. The standard is critical for quality control in metallurgical processing and procurement of raw materials for electronic packaging.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.